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GS816018/32/36t-250/ 225/200/166/150/133 1m x 18, 512k x 32, 512k x 36 18mb sync burst srams 250 mhz ? 133 mhz 2.5 v or 3.3 v v dd 2.5 v or 3.3 v i/o 100-pin tqfp commercial temp industrial temp rev: 2.14 11/2004 1/25 ? 1999, gsi technology specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. features ? ft pin for user-configurable flow through or pipeline operation ? single cycle deselect (scd) operation ? 2.5 v or 3.3 v +10%/?10% core power supply ? 2.5 v or 3.3 v i/o supply ? lbo pin for linear or interleaved burst mode ? internal input resistors on mode pins allow floating mode pins ? default to interleaved pipeline mode ? byte write (bw ) and/or global write (gw ) operation ? internal self-timed write cycle ? automatic power-down for portable applications ? jedec-standard 100- lead tqfp package functional description applications the GS816018/32/36t is an 18,874,368-bit (16,777,216-bit for x32 version) high performa nce synchronous sram with a 2-bit burst address counter. al though of a type originally developed for level 2 cache applications supporting high performance cpus, the device now finds application in synchronous sram applications, ranging from dsp main store to networking chip set support. controls addresses, data i/os, chip enables (e1 , e2, e3 ), address burst control inputs (adsp , adsc , adv ), and write control inputs (bx , bw , gw ) are synchronous and are controlled by a positive-edge-triggered clock input (ck). output enable (g ) and power down control (zz) ar e asynchronous inputs. burst cycles can be initiated with either adsp or adsc inputs. in burst mode, subsequent burst addresses are generated internally and are controlled by adv . the burst address counter may be configured to count in either linear or interleave order with the linear burst order (lbo ) input. the burst function need not be used . new addresses can be loaded on every cycle with no degradation of chip performance. flow through/pipeline reads the function of the data output register can be controlled by the user via the ft mode pin (pin 14). holding the ft mode pin low places the ram in flow through mode, causing output data to bypass the data output register. holding ft high places the ram in pipeline mode, activating the rising- edge-triggered data output register. byte write and global write byte write operation is performed by using byte write enable (bw ) input combined with one or more individual byte write signals (bx ). in addition, global write (gw ) is available for writing all bytes at one time, regardless of the byte write control inputs. sleep mode low power (sleep mode) is attained through the assertion (high) of the zz signal, or by stopping the clock (ck). memory data is retained during sleep mode. core and interface voltages the GS816018/32/36t operates on a 2.5 v or 3.3 v power supply. all input are 3.3 v and 2.5 v compatible. separate output power (v ddq ) pins are used to decouple output noise from the internal ci rcuits and are 3.3 v and 2.5 v compatible. parameter synopsis -250 -225 -200 -166 -150 -133 unit pipeline 3-1-1-1 t kq tcycle 2.5 4.0 2.7 4.4 3.0 5.0 3.4 6.0 3.8 6.7 4.0 7.5 ns ns 3.3 v curr (x18) curr (x32/x36) 280 330 255 300 230 270 200 230 185 215 165 190 ma ma 2.5 v curr (x18) curr (x32/x36) 275 320 250 295 230 265 195 225 180 210 165 185 ma ma flow through 2-1-1-1 t kq tcycle 5.5 5.5 6.0 6.0 6.5 6.5 7.0 7.0 7.5 7.5 8.5 8.5 ns ns 3.3 v curr (x18) curr (x32/x36) 175 200 165 190 160 180 150 170 145 165 135 150 ma ma 2.5 v curr (x18) curr (x32/x36) 175 200 165 190 160 180 150 170 145 165 135 150 ma ma
GS816018/32/36t-250/ 225/200/166/150/133 specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. rev: 2.14 11/2004 2/25 ? 1999, gsi technology GS816018 100-pin tqfp pinout (package t) 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 v ddq v ss dq b dq b v ss v ddq dq b dq b v dd nc v ss dq b dq b v ddq v ss dq b dq b dqp b v ss v ddq v ddq v ss dq a dq a v ss v ddq dq a dq a v ss nc v dd zz dq a dq a v ddq v ss dq a dq a v ss v ddq lbo a a a a a 1 a 0 nc nc v ss v dd a a a a a a a a a a e 1 e 2 nc nc b b b a e 3 ck gw bw v dd v ss g adsc adsp adv a a a 1m x 18 top view dqp a a nc nc nc nc nc nc nc nc nc nc nc nc nc nc nc nc nc 10099989796959493929190898887868584838281 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 ft
GS816018/32/36t-250/ 225/200/166/150/133 specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. rev: 2.14 11/2004 3/25 ? 1999, gsi technology gs816032 100-pin tqfp pinout (package t) 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 v ddq v ss dq c dq c v ss v ddq dq c dq c v dd nc v ss dq d dq d v ddq v ss dq d dq d dq d v ss v ddq v ddq v ss dq b dq b v ss v ddq dq b dq b v ss nc v dd zz dq a dq a v ddq v ss dq a dq a v ss v ddq lbo a a a a a 1 a 0 nc nc v ss v dd a a a a a a a a a a e 1 e 2 b d b c b b b a e 3 ck gw bw v dd v ss g adsc adsp adv a a a 512k x 32 top view dq b nc dq b dq b dq b dq a dq a dq a dq a nc dq c dq c dq c dq d dq d dq d nc dq c nc 10099989796959493929190898887868584838281 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 ft
GS816018/32/36t-250/ 225/200/166/150/133 specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. rev: 2.14 11/2004 4/25 ? 1999, gsi technology gs816036 100-pin tqfp pinout (package t) 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 v ddq v ss dq c dq c v ss v ddq dq c dq c v dd nc v ss dq d dq d v ddq v ss dq d dq d dq d v ss v ddq v ddq v ss dq b dq b v ss v ddq dq b dq b v ss nc v dd zz dq a dq a v ddq v ss dq a dq a v ss v ddq lbo a a a a a 1 a 0 nc nc v ss v dd a a a a a a a a a a e 1 e 2 b d b c b b b a e 3 ck gw bw v dd v ss g adsc adsp adv a a a 512k x 36 top view dq b dqp b dq b dq b dq b dq a dq a dq a dq a dqp a dq c dq c dq c dq d dq d dq d dqp d dq c dqp c 10099989796959493929190898887868584838281 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 ft
GS816018/32/36t-250/ 225/200/166/150/133 specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. rev: 2.14 11/2004 5/25 ? 1999, gsi technology tqfp pin description symbol type description a 0 , a 1 i address field lsbs and address counter preset inputs a i address input dq a dq b dq c dq d i/o data input and output pins nc no connect bw ibyte write ? writes all enabled bytes; active low b a , b b, b c , b d i byte write enable for dq a , dq b data i/os; active low ck i clock input signal; active high gw i global write enable ? writes all bytes; active low e 1 , e 3 i chip enable; active low e 2 i chip enable; active high g i output enable; active low adv i burst address counter advance enable; active low adsp , adsc i address strobe (processor, cache controller); active low zz i sleep mode control; active high ft i flow through or pipeline mode; active low lbo i linear burst order mode; active low v dd i core power supply v ss i i/o and core ground v ddq i output driver power supply
GS816018/32/36t-250/ 225/200/166/150/133 specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. rev: 2.14 11/2004 6/25 ? 1999, gsi technology GS816018/32/36 block diagram a1 a0 a0 a1 d0 d1 q1 q0 counter load dq dq register register dq register dq register dq register dq register dq register dq register d q register d q register a0 ? an lbo adv ck adsc adsp gw bw e 1 g zz power down control memory array 36 36 4 a qd e 2 e 3 dqx1 ? dqx9 note: only x36 version shown for simplicity. 1 b a b b b c b d ft
GS816018/32/36t-250/ 225/200/166/150/133 specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. rev: 2.14 11/2004 7/25 ? 1999, gsi technology note: there is a pull-up device on the ft pin and a pull-down device on the zz pin, so this input pin can be unconnected a nd the chip will operate in the default states as specified in the above tables. burst counter sequences bpr 1999.05.18 mode pin functions mode name pin name state function burst order control lbo l linear burst h interleaved burst output register control ft l flow through h or nc pipeline power down control zz l or nc active h standby, i dd = i sb note: the burst counter wraps to initial state on the 5th clock. note: the burst counter wraps to initial state on the 5th clock. linear burst sequence a[1:0] a[1:0] a[1:0] a[1:0] 1st address 00 01 10 11 2nd address 01 10 11 00 3rd address 10 11 00 01 4th address 11 00 01 10 interleaved burst sequence a[1:0] a[1:0] a[1:0] a[1:0] 1st address 00 01 10 11 2nd address 01 00 11 10 3rd address 10 11 00 01 4th address 11 10 01 00
GS816018/32/36t-250/ 225/200/166/150/133 specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. rev: 2.14 11/2004 8/25 ? 1999, gsi technology notes: 1. all byte outputs are active in read cycles regar dless of the state of byte write enable inputs. 2. byte write enable inputs b a , b b , b c and/or b d may be used in any combination with bw to write single or multiple bytes. 3. all byte i/os remain high-z during all write operations regardless of the state of byte write enable inputs. 4. bytes ? c ? and ? d ? are only available on t he x32 and x36 versions. byte write truth table function gw bw b a b b b c b d notes read h h x x x x 1 read hlhhhh1 write byte a h l l h h h 2, 3 write byte b h l h l h h 2, 3 write byte c h l h h l h 2, 3, 4 write byte d h l h h h l 2, 3, 4 write all byteshlllll2, 3, 4 write all byteslxxxxx
GS816018/32/36t-250/ 225/200/166/150/133 specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. rev: 2.14 11/2004 9/25 ? 1999, gsi technology synchronous truth table operation address used state diagram key 5 e 1 e 2 adsp adsc adv w 3 dq 4 deselect cycle, power down none x h x x l x x high-z deselect cycle, power down none x l f l x x x high-z deselect cycle, power down none x l f h l x x high-z read cycle, begin burst external r l t l x x x q read cycle, begin burst external r l t h l x f q write cycle, begin burst external w l t h l x t d read cycle, continue burst next cr x x h h l f q read cycle, continue burst next cr h x x h l f q write cycle, continue burst next cw x x h h l t d write cycle, continue burst next cw h x x h l t d read cycle, suspend burst current x x h h h f q read cycle, suspend burst current h x x h h f q write cycle, suspend burst current x x h h h t d write cycle, suspend burst current h x x h h t d notes: 1. x = don?t care, h = high, l = low 2. e = t (true) if e 2 = 1 and e 3 = 0; e = f (false) if e 2 = 0 or e 3 = 1 3. w = t (true) and f (false) is defined in the byte write truth table preceding. 4. g is an asynchronous input. g can be driven high at any time to disable active output drivers. g low can only enable active drivers (shown as ?q? in the truth table above). 5. all input combinations shown above are tested and supported. in put combinations shown in gray boxes need not be used to accom plish basic synchronous or synchronous burst oper ations and may be avoided for simplicity. 6. tying adsp high and adsc low allows simple non-burst synchronous operations. see bold items above. 7. tying adsp high and adv low while using adsc to load new addresses allows simple burst operations. see italic items above.
GS816018/32/36t-250/ 225/200/166/150/133 specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. rev: 2.14 11/2004 10/25 ? 1999, gsi technology simplified state diagram first write first read burst write burst read deselect r w cr cw x x wr r wr x x x simple synchronous operation simple burst synchronous operation cr r cw cr cr notes: 1. the diagram shows only supported (tested) synchr onous state transitions. the diagram presumes g is tied low. 2. the upper portion of the diagram assume s active use of only the enable (e1 , e2, and e3 ) and write (b a , b b , b c , b d , bw , and gw ) control inputs, and that adsp is tied high and adsc is tied low. 3. the upper and lower portions of the diagram together a ssume active use of only the enable, write, and adsc control inputs, and assumes adsp is tied high and adv is tied low.
GS816018/32/36t-250/ 225/200/166/150/133 specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. rev: 2.14 11/2004 11/25 ? 1999, gsi technology simplified state diagram with g first write first read burst write burst read deselect r w cr cw x x wr r w r x x x cr r cw cr cr w cw w cw notes: 1. the diagram shows supported (tes ted) synchronous state transit ions plus supported transitions that depend upon the use of g . 2. use of ?dummy reads ? (read cycles with g high) may be used to make the transition from read cycles to write cycles without passing through a deselect cycle. dummy read cycles increment the address counter just like normal read cycles. 3. transitions shown in gray tone assume g has been pulsed high long enough to turn the ram?s drivers off and for incoming data to meet data input set up time.
GS816018/32/36t-250/ 225/200/166/150/133 specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. rev: 2.14 11/2004 12/25 ? 1999, gsi technology note: permanent damage to the device may occur if the absolute maximum ratings are exceeded. operation should be restricted to recomm ended operating conditions. exposure to conditions exceeding the absolute maximum ra tings, for an extended period of time, may affect reliability of this component. absolute maximum ratings (all voltages reference to v ss ) symbol description value unit v dd voltage on v dd pins ? 0.5 to 4.6 v v ddq voltage in v ddq pins ? 0.5 to 4.6 v v i/o voltage on i/o pins ? 0.5 to v ddq +0.5 ( 4.6 v max.) v v in voltage on other input pins ? 0.5 to v dd +0.5 ( 4.6 v max.) v i in input current on any pin +/ ? 20 ma i out output current on any i/o pin +/ ? 20 ma p d package power dissipation 1.5 w t stg storage temperature ? 55 to 125 o c t bias temperature under bias ? 55 to 125 o c power supply voltage ranges parameter symbol min. typ. max. unit notes 3.3 v supply voltage v dd3 3.0 3.3 3.6 v 2.5 v supply voltage v dd2 2.3 2.5 2.7 v 3.3 v v ddq i/o supply voltage v ddq3 3.0 3.3 3.6 v 2.5 v v ddq i/o supply voltage v ddq2 2.3 2.5 2.7 v notes: 1. the part numbers of industrial temperatur e range versions end the character ?i?. un less otherwise noted, all performance spe cifica- tions quoted are evaluated for worst case in the temperature range marked on the device. 2. input under/overshoot voltage must be ? 2 v > vi < v ddn +2 v not to exceed 4.6 v maximum, with a pulse width not to exceed 20% tkc.
GS816018/32/36t-250/ 225/200/166/150/133 specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. rev: 2.14 11/2004 13/25 ? 1999, gsi technology v ddq3 range logic levels parameter symbol min. typ. max. unit notes v dd input high voltage v ih 2.0 ? v dd + 0.3 v1 v dd input low voltage v il ? 0.3 ? 0.8 v 1 v ddq i/o input high voltage v ihq 2.0 ? v ddq + 0.3 v1,3 v ddq i/o input low voltage v ilq ? 0.3 ? 0.8 v 1,3 notes: 1. the part numbers of industrial temperatur e range versions end the character ?i?. un less otherwise noted, all performance spe cifica- tions quoted are evaluated for worst case in the temperature range marked on the device. 2. input under/overshoot voltage must be ? 2 v > vi < v ddn +2 v not to exceed 4.6 v maximum, with a pulse width not to exceed 20% tkc. 3. v ihq (max) is voltage on v ddq pins plus 0.3 v. v ddq2 range logic levels parameter symbol min. typ. max. unit notes v dd input high voltage v ih 0.6*v dd ? v dd + 0.3 v1 v dd input low voltage v il ? 0.3 ? 0.3*v dd v1 v ddq i/o input high voltage v ihq 0.6*v dd ? v ddq + 0.3 v1,3 v ddq i/o input low voltage v ilq ? 0.3 ? 0.3*v dd v1,3 notes: 1. the part numbers of industrial temperatur e range versions end the character ?i?. un less otherwise noted, all performance spe cifica- tions quoted are evaluated for worst case in the temperature range marked on the device. 2. input under/overshoot voltage must be ? 2 v > vi < v ddn +2 v not to exceed 4.6 v maximum, with a pulse width not to exceed 20% tkc. 3. v ihq (max) is voltage on v ddq pins plus 0.3 v. recommended operating temperatures parameter symbol min. typ. max. unit notes ambient temperature (com mercial range versions) t a 02570 c2 ambient temperature (industrial range versions) t a ? 40 25 85 c2 notes: 1. the part numbers of industrial temperatur e range versions end the character ?i?. un less otherwise noted, all performance spe cifica- tions quoted are evaluated for worst case in the temperature range marked on the device. 2. input under/overshoot voltage must be ? 2 v > vi < v ddn +2 v not to exceed 4.6 v maximum, with a pulse width not to exceed 20% tkc.
GS816018/32/36t-250/ 225/200/166/150/133 specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. rev: 2.14 11/2004 14/25 ? 1999, gsi technology note: these parameters are sample tested. capacitance (t a = 25 o c, f = 1 mh z , v dd = 2.5 v) parameter symbol test conditions typ. max. unit input capacitance c in v in = 0 v 45pf input/output capacitance c i/o v out = 0 v 67pf ac test conditions parameter conditions input high level v dd ? 0.2 v input low level 0.2 v input slew rate 1 v/ns input reference level v dd /2 output reference level v ddq /2 output load fig. 1 notes: 1. include scope and jig capacitance. 2. test conditions as specified with output loading as shown in fig. 1 unless otherwise noted. 3. device is deselected as defined by the truth table. 50% tkc v ss ? 2.0 v 50% v ss v ih undershoot measurement and timing overshoot measurement and timing 50% tkc v dd + 2.0 v 50% v dd v il dq v ddq/2 50 ? 30pf * output load 1 * distributed test jig capacitance
GS816018/32/36t-250/ 225/200/166/150/133 specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. rev: 2.14 11/2004 15/25 ? 1999, gsi technology dc electrical characteristics parameter symbol test conditions min max input leakage current (except mode pins) i il v in = 0 to v dd ? 1 ua 1 ua zz input current i in1 v dd v in v ih 0 v v in v ih ? 1 ua ? 1 ua 1 ua 100 ua ft input current i in2 v dd v in v il 0 v v in v il ? 100 ua ? 1 ua 1 ua 1 ua output leakage current i ol output disable, v out = 0 to v dd ? 1 ua 1 ua output high voltage v oh2 i oh = ? 8 ma, v ddq = 2.375 v 1.7 v ? output high voltage v oh3 i oh = ? 8 ma, v ddq = 3.135 v 2.4 v ? output low voltage v ol i ol = 8 ma ? 0.4 v
GS816018/32/36t-250/ 225/200/166/150/133 specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. rev: 2.14 11/2004 16/25 ? 1999, gsi technology notes: 1. i dd and i ddq apply to any combination of v dd3 , v dd2 , v ddq3 , and v ddq2 operation. 2. all parameters listed are worst case scenario. operating currents parameter test conditions mode symbol -250 -225 -200 -166 -150 -133 unit 0 to 70c ? 40 to 85c 0 to 70c ? 40 to 85c 0 to 70c ? 40 to 85c 0 to 70c ? 40 to 85c 0 to 70c ? 40 to 85c 0 to 70c ? 40 to 85c operating current 3.3 v device selected; all other inputs v ih o r v il output open (x32/ x36) pipeline i dd i ddq 290 40 300 40 265 35 275 35 240 30 250 30 205 25 215 25 190 25 200 25 170 20 180 20 ma flow through i dd i ddq 180 20 190 20 170 20 180 20 165 15 175 15 155 15 165 15 150 15 160 15 140 10 150 10 ma (x18) pipeline i dd i ddq 260 20 270 20 235 20 245 20 215 15 225 15 185 15 195 15 170 15 180 15 155 10 165 10 ma flow through i dd i ddq 165 10 175 10 155 10 165 10 150 10 160 10 140 10 150 10 135 10 145 10 125 10 135 10 ma operating current 2.5 v device selected; all other inputs v ih o r v il output open (x32/ x36) pipeline i dd i ddq 290 30 300 30 265 30 275 30 240 25 250 25 205 20 215 20 190 20 200 20 170 15 180 15 ma flow through i dd i ddq 180 20 190 20 170 20 180 20 165 15 175 15 155 15 165 15 150 15 160 15 140 10 150 10 ma (x18) pipeline i dd i ddq 260 15 270 15 235 15 245 15 215 15 225 15 185 10 195 10 170 10 180 10 155 10 165 10 ma flow through i dd i ddq 165 10 175 10 155 10 165 10 150 10 160 10 140 10 150 10 135 10 145 10 125 10 135 10 ma standby current zz v dd ? 0.2 v ? pipeline i sb 20 30 20 30 20 30 20 30 20 30 20 30 ma flow through i sb 20 30 20 30 20 30 20 30 20 30 20 30 ma deselect current device deselected; all other inputs v ih or v il ? pipeline i dd 85 90 80 85 75 80 64 70 60 65 50 55 ma flow through i dd 60 65 60 65 50 55 50 55 50 55 45 50 ma
GS816018/32/36t-250/ 225/200/166/150/133 specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. rev: 2.14 11/2004 17/25 ? 1999, gsi technology notes: 1. these parameters are sampled and are not 100% tested. 2. zz is an asynchronous signal. however, in order to be recogniz ed on any given clock cycle, zz mu st meet the specified setup a nd hold times as specified above. ac electrical characteristics parameter symbol -250 -225 -200 -166 -150 -133 unit min max min max min max min max min max min max pipeline clock cycle time tkc 4.0 ? 4.4 ? 5.0 ? 6.0 ? 6.7 ? 7.5 ? ns clock to output valid tkq ? 2.5 ? 2.7 ? 3.0 ? 3.4 ? 3.8 ? 4.0 ns clock to output invalid tkqx 1.5 ? 1.5 ? 1.5 ? 1.5 ? 1.5 ? 1.5 ? ns clock to output in low-z tlz 1 1.5 ? 1.5 ? 1.5 ? 1.5 ? 1.5 ? 1.5 ? ns setup time ts 1.2 ? 1.3 ? 1.4 ? 1.5 ? 1.5 ? 1.5 ? ns hold time th 0.2 ? 0.3 ? 0.4 ? 0.5 ? 0.5 ? 0.5 ? ns flow through clock cycle time tkc 5.5 ? 6.0 ? 6.5 ? 7.0 ? 7.5 ? 8.5 ? ns clock to output valid tkq ? 5.5 ? 6.0 ? 6.5 ? 7.0 ? 7.5 ? 8.5 ns clock to output invalid tkqx 3.0 ? 3.0 ? 3.0 ? 3.0 ? 3.0 ? 3.0 ? ns clock to output in low-z tlz 1 3.0 ? 3.0 ? 3.0 ? 3.0 ? 3.0 ? 3.0 ? ns setup time ts 1.5 ? 1.5 ? 1.5 ? 1.5 ? 1.5 ? 1.5 ? ns hold time th 0.5 ? 0.5 ? 0.5 ? 0.5 ? 0.5 ? 0.5 ? ns clock high time tkh 1.3 ? 1.3 ? 1.3 ? 1.3 ? 1.5 ? 1.7 ? ns clock low time tkl 1.5 ? 1.5 ? 1.5 ? 1.5 ? 1.7 ? 2 ? ns clock to output in high-z thz 1 1.5 2.3 1.5 2.5 1.5 3.0 1.5 3.0 1.5 3.0 1.5 3.0 ns g to output valid toe ? 2.3 ? 2.5 ? 3.2 ? 3.5 ? 3.8 ? 4.0 ns g to output in low-z tolz 1 0 ? 0 ? 0 ? 0 ? 0 ? 0 ? ns g to output in high-z tohz 1 ? 2.3 ? 2.5 ? 3.0 ? 3.0 ? 3.0 ? 3.0 ns zz setup time tzzs 2 5 ? 5 ? 5 ? 5 ? 5 ? 5 ? ns zz hold time tzzh 2 1 ? 1 ? 1 ? 1 ? 1 ? 1 ? ns zz recovery tzzr 20 ? 20 ? 20 ? 20 ? 20 ? 20 ? ns
GS816018/32/36t-250/ 225/200/166/150/133 specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. rev: 2.14 11/2004 18/25 ? 1999, gsi technology pipeline mode timing begin read a cont cont deselect write b read c read c+1 read c+2 read c+3 cont deselect thz tkqx tkq tlz th ts tohz toe th ts th ts th ts th ts th ts ts th ts th ts th ts burst read burst read single write tkc tkc tkl tkl tkh single write single read tkh single read q(a) d(b) q(c) q(c+1) q(c+2) q(c+3) abc deselected with e1 e1 masks adsp e2 and e3 only sampled with adsp and adsc adsc initiated read ck adsp adsc adv a0?an gw bw ba ?bd e1 e2 e3 g dqa?dqd
GS816018/32/36t-250/ 225/200/166/150/133 specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. rev: 2.14 11/2004 19/25 ? 1999, gsi technology flow through mode timing begin read a cont cont write b read c read c+1 read c+2 read c+3 read c cont deselect thz tkqx tkq tlz th ts tohz toe th ts th ts th ts th ts th ts th ts th ts th ts th ts th ts tkc tkc tkl tkl tkh tkh abc q(a) d(b) q(c) q(c+1) q(c+2) q(c+3) q(c) e2 and e3 only sampled with adsc adsc initiated read deselected with e1 fixed high ck adsp adsc adv a0?an gw bw ba ?bd e1 e2 e3 g dqa?dqd
GS816018/32/36t-250/ 225/200/166/150/133 specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. rev: 2.14 11/2004 20/25 ? 1999, gsi technology sleep mode during normal operation, zz must be pulled low, either by the us er or by its internal pull down resistor. when zz is pulled hig h, the sram will enter a power sleep mode after 2 cycles. at this time, internal stat e of the sram is preserved. when zz returns t o low, the sram operates normally after zz recovery time. sleep mode is a low current, power-down mode in which the device is deselected and current is reduced to i sb 2. the duration of sleep mode is dictated by the length of time the zz is in a high state. after entering sleep mode, all inputs except zz become disabled and all outputs go to high-z the zz pin is an async hronous, active high input that cau ses the device to enter sleep mo de. when the zz pin is driven high, i sb 2 is guaranteed after the time tzzi is met. because zz is an asynchronous input, pending operations or operations in progress may not be properly completed if zz is asserted. therefore, sleep mode must not be initiat ed until valid pending operations are completed. similarly, when exitin g sleep mode during tzzr, only a deselect or read commands may be applied while the sram is recovering from sleep mode. sleep mode timing diagram application tips single and dual cycle deselect scd devices (like this one) force the use of ?dummy read cycles? (read cycles that ar e launched normally bu t that are ended wit h the output drivers inactive) in a fully sy nchronous environment. dumm y read cycles waste performance but their use usually assures there will be no bus c ontention in transitions from reads to writes or between banks of rams. dcd srams do not waste bandwidth on dummy cycles and are logically simpler to manage in a multiple bank application (wait states need not be inserted at bank address boundary crossings) but greater care mu st be exercised to avoid excessive bus contention. tzzr tzzh tzzs hold setup tkl tkl tkh tkh tkc tkc ck adsp adsc zz
GS816018/32/36t-250/ 225/200/166/150/133 specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. rev: 2.14 11/2004 21/25 ? 1999, gsi technology tqfp package drawing (package t) d1 d e1 e pin 1 b e c l l1 a2 a1 y notes: 1. all dimensions are in millimeters (mm). 2. package width and length do not include mold protrusion. symbol description min. nom. max a1 standoff 0.05 0.10 0.15 a2 body thickness 1.35 1.40 1.45 b lead width 0.20 0.30 0.40 c lead thickness 0.09 ? 0.20 d terminal dimension 21.9 22.0 22.1 d1 package body 19.9 20.0 20.1 e terminal dimension 15.9 16.0 16.1 e1 package body 13.9 14.0 14.1 e lead pitch ? 0.65 ? l foot length 0.45 0.60 0.75 l1 lead length ? 1.00 ? y coplanarity 0.10 lead angle 0 ? 7
GS816018/32/36t-250/ 225/200/166/150/133 specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. rev: 2.14 11/2004 22/25 ? 1999, gsi technology ordering information for gsi synchronous burst rams org part number 1 type package speed 2 (mhz/ns) t a 3 status 1m x 18 GS816018t-250 pipeline/flow through tqfp 250/5.5 c 1m x 18 GS816018t-225 pipeline/flow through tqfp 225/6 c 1m x 18 GS816018t-200 pipeline/flow through tqfp 200/6.5 c 1m x 18 GS816018t-166 pipeline/flow through tqfp 166/7 c 1m x 18 GS816018t-150 pipeline/flow through tqfp 150/7.5 c 1m x 18 GS816018t-133 pipeline/flow through tqfp 133/8.5 c 512k x 32 gs816032t-250 pipeline/flow through tqfp 250/5.5 c 512k x 32 gs816032t-225 pipeline/flow through tqfp 225/6 c 512k x 32 gs816032t-200 pipeline/flow through tqfp 200/6.5 c 512k x 32 gs816032t-166 pipeline/flow through tqfp 166/7 c 512k x 32 gs816032t-150 pipeline/flow through tqfp 150/7.5 c 512k x 32 gs816032t-133 pipeline/flow through tqfp 133/8.5 c 512k x 36 gs816036t-250 pipeline/flow through tqfp 250/5.5 c 512k x 36 gs816036t-225 pipeline/flow through tqfp 225/6 c 512k x 36 gs816036t-200 pipeline/flow through tqfp 200/6.5 c 512k x 36 gs816036t-166 pipeline/flow through tqfp 166/7 c 512k x 36 gs816036t-150 pipeline/flow through tqfp 150/7.5 c 512k x 36 gs816036t-133 pipeline/flow through tqfp 133/8.5 c 1m x 18 GS816018t-250i pipeline/flow through tqfp 250/5.5 i 1m x 18 GS816018t-225i pipeline/flow through tqfp 225/6 i 1m x 18 GS816018t-200i pipeline/flow through tqfp 200/6.5 i 1m x 18 GS816018t-166i pipeline/flow through tqfp 166/7 i 1m x 18 GS816018t-150i pipeline/flow through tqfp 150/7.5 i 1m x 18 GS816018t-133i pipeline/flow through tqfp 133/8.5 i 512k x 32 gs816032t-250i pipeline/flow through tqfp 250/5.5 i 512k x 32 gs816032t-225i pipeline/flow through tqfp 225/6 i notes: 1. customers requiring delivery in tape and reel should add the character ?t? to t he end of the part number. example: GS816018t- 150it. 2. the speed column indicates the cycle frequenc y (mhz) of the device in pipeline mode and the latency (ns) in flow through mod e. each device is pipeline/flow through mode-selectable by the user. 3. t a = c = commercial temperature range. t a = i = industrial temperature range. 4. gsi offers other versions this type of device in many differ ent configurations and with a vari ety of different features, on ly some of which are covered in this data sheet. see the gs i technology web site (www.gsitechnology.com ) for a complete listing of current offerings.
GS816018/32/36t-250/ 225/200/166/150/133 specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. rev: 2.14 11/2004 23/25 ? 1999, gsi technology 512k x 32 gs816032t-200i pipeline/flow through tqfp 200/6.5 i 512k x 32 gs816032t-166i pipeline/flow through tqfp 166/7 i 512k x 32 gs816032t-150i pipeline/flow through tqfp 150/7.5 i 512k x 32 gs816032t-133i pipeline/flow through tqfp 133/8.5 i 512k x 36 gs816036t-250i pipeline/flow through tqfp 250/5.5 i 512k x 36 gs816036t-225i pipeline/flow through tqfp 225/6 i 512k x 36 gs816036t-200i pipeline/flow through tqfp 200/6.5 i 512k x 36 gs816036t-166i pipeline/flow through tqfp 166/7 i 512k x 36 gs816036t-150i pipeline/flow through tqfp 150/7.5 i 512k x 36 gs816036t-133i pipeline/flow through tqfp 133/8.5 i ordering information for gsi synchronous burst rams org part number 1 type package speed 2 (mhz/ns) t a 3 status notes: 1. customers requiring delivery in tape and reel should add the character ?t? to t he end of the part number. example: GS816018t- 150it. 2. the speed column indicates the cycle frequenc y (mhz) of the device in pipeline mode and the latency (ns) in flow through mod e. each device is pipeline/flow through mode-selectable by the user. 3. t a = c = commercial temperature range. t a = i = industrial temperature range. 4. gsi offers other versions this type of device in many differ ent configurations and with a vari ety of different features, on ly some of which are covered in this data sheet. see the gs i technology web site (www.gsitechnology.com ) for a complete listing of current offerings.
GS816018/32/36t-250/ 225/200/166/150/133 specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. rev: 2.14 11/2004 24/25 ? 1999, gsi technology 18mb sync sram datasheet revision history ds/daterev. code: old; new types of changes format or content page;revisions;reason GS816018t-150it 1.00 9/ 1999a;GS816018t-150it 2.00 1/1999b content ? converted from 0.25u 3.3v process to 0.18u 2.5v process. master file rev b ? added x72 pinout. ? added gsi logo. GS816018t- 2.00 11/ 1999b;GS816018t 2.01 1/ 2000c format ? changed flow-through read-wri te cycle timing diagram for accuracy GS816018t 2.01 1/ 2000c;GS816018 t 2.02 1/ 2000d ? changed pin description in tqfp to match order of pins in pinout. gs18/362.0 1/2000dgs18/ 362.03 2/2000e ? front page; features - changed 2.5v i/o supply to 2.5v or3.3v i/o supply; core and interface voltages - changed paragraph to include information for 3.3v;completeness ? absolute maximum ratings; changed vddq - value: from: - .05 to vdd : to : -.05 to 3.6; completeness. ? recommended operating conditions;changed: i/o supply voltage- max. from vdd to 3.6; input high voltage- max. from vdd +0.3 to 3.6; same page - took out note 1;completeness ? electrical characteristics - added second output high voltage line to table; completeness. ? note: there was not a rev 2.02 for the 8160z or the 8161z. gs18/362.03 2/2000e; 816018_r2_04 content ? input high voltage (p. 11) changed to 0.7* v dd ? input low voltage (p.11) changed to 0.3* v dd 816018_r2_04; 816018_r2_05 content ? changed the value of zz recovery in the ac electrical characteristics table on page 15 from 20 ns to 100 ns 816018_r2_05; 816018_r2_06 content/format ? added 225 mhz speed bin ? updated pg. 1 table, ac characteristics table, and operating currents table to match 815xxx ? updated format to comply with technical publications standards 816018_r2_06; 816018_r2_07 content ? updated capitance table?removed input row and changed output row to i/o 816018_r2_07; 816018_r2_08 content ? updated features list on page 1 ? completely reworked table on page 1 ? updated mode pin functions tableon page 7 816018_r2_08; 816018_r2_09 content ? added 3.3 v references to entire document ? updated operating conditions table ? added pin 56 to pin description table ? updated operating currents table and added note ? updated application tips paragraph ? updated table on page 1; added power numbers
GS816018/32/36t-250/ 225/200/166/150/133 specifications cited are subject to change without notice . for latest documentation see http://www.gsitechnology.com. rev: 2.14 11/2004 25/25 ? 1999, gsi technology 816018_r2_09; 816018_r2_10 content ? updated operating currents table ? updated table on page 1; updated power numbers ? updated recommended operating conditions table (added v ddq references) 816018_r2_10; 816018_r2_11 content ? updated table on page 1 ? created recommended operating conditions tables on pages 12 and 13 ? updated ac electrical characteristics table ? added sleep mode description on page 23 ? updated ordering information for 225 mhz part (changed from 7ns to 6.5 ns) ? added 250 mhz speed bin ? deleted 180 mhz speed bin 816018_r2_11; 816018_r2_12 content ? updated ac characteristics table ? updated ft power numbers ? updated mb references from 16mb to 18mb ? updated ac test conditions table and removed output load 2 diagram 816018_r2_12; 816018_r2_13 content ? removed preliminary banner ? removed pin locations from pin description table 816018_r2_13; 816018_r2_14 format/content ? updated format ? updated timing diagrams 18mb sync sram datasheet revision history ds/daterev. code: old; new types of changes format or content page;revisions;reason

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